Fine grinding of silicon wafers: effects of chuck shape on ...
Fine grinding of silicon wafers: effects of chuck shape on grinding marks Wangping Suna, Z.J. Peia,*, G.R. Fisherb aDepartment of Industrial and Manufacturing Systems Engineering, Kansas State University, 237 Durland Hall, Manhattan, KS 66506, USA bMEMC Electronic Materials, Inc., 501 Pearl Drive, St Peters, MO 63376, USA Received 15 July 2004; accepted 28 September 2004
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